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Texas Instruments launches advanced ultrasonic lens cleaning chipset that can achieve self cleaning of cameras and sensors

Time:2023-12-31 Views:465
    Texas Instruments (TI) (Nasdaq code: TXN) today launched advanced specialized semiconductors using Ultrasonic Lens Cleaning (ULC) technology, enabling camera systems to quickly detect and use small vibrations to remove dirt, ice, and water.
    In the past, removing pollutants from camera lenses required manual cleaning, which could lead to system shutdowns or the use of various mechanical components that could malfunction. The TI new ULC chipset (including ULC1001 digital signal processor (DSP) and matching DRV2901 piezoelectric transducer driver) adopts a proprietary technology that allows the camera to use precisely controlled vibration to quickly self remove pollutants, thereby quickly eliminating debris, improving system accuracy and reducing maintenance requirements. This chipset provides designers with a compact and cost-effective way to use ULC in various applications and different camera sizes. For more information, please visit www.ti.com/ulc1001 pr cn and www.ti.com/drv2901 pr cn.
    TI Product Marketing Engineer Avi Yashar stated: ULC can make the widespread use of self-cleaning cameras and sensors a reality. Existing cleaning methods are expensive and impractical, requiring complex mechanical devices, expensive electronic devices, and extensive processing work to detect pollutants and perform cleaning. With the continuous development of various applications from cars and traffic cameras to smart cities and manufacturing, the number of cameras is increasing rapidly, and people urgently need a simple and efficient solution Efficient ways to achieve self-cleaning cameras
    The ULC1001 controller includes proprietary algorithms for automatic sensing, cleaning, temperature, and fault detection, without the need for any image processing, making ULC technology highly adaptable and suitable for various camera lens designs. The compact appearance of this chipset makes it possible to improve machine vision and sensing in various applications, anywhere where cameras or sensors may become dirty. To understand its working principle, please read the technical article "Ultrasonic Lens Cleaning: Solid State Technology You Need Without Understanding".
    Edward Sanchez, Senior Analyst for Global Automotive Business at TechInsights, said, "With the advanced driving assistance system (ADAS) It has become increasingly complex, and drivers are increasingly reliant on them, making it more important than ever to keep the sensor kit running properly. If there is dirt or foreign objects on the camera lens, it may be a bit troublesome for the rearview camera, but it becomes a crucial functional and safety issue for vehicles that rely on highly accurate imaging and sensor data. This will soon become a serious problem in the fields of ADAS and autonomous driving, and TI‘s ULC method will solve it in a practical and cost-effective way
Reduce system size and complexity with integrated solutions
    Using TI‘s ULC chipset eliminates the need for complex mechanical components and manual intervention in lens cleaning systems. The ULC1001 ultrasonic cleaning DSP, which uses proprietary algorithms, integrates a pulse width modulator, current and voltage detection amplifier, and analog-to-digital converter. The TI chipset, when used in conjunction with the DRV2901 piezoelectric transducer driver as a supporting amplifier, can achieve ULC in compact packaging with printed circuit board dimensions less than 25mm x 15mm, thereby reducing the bill of materials and providing more functionality than vertical implementation.
Packaging, supply situation, and price
    ULC1001 DSP has started mass production and can be purchased on TI.com or through authorized distributors. The device uses 4.5mm x 4.5mm, 32 pin HotRod ™ Quad Flat No Read (QFN) packaging. The DRV2901 piezoelectric transducer driver is now available on the market and can now be fully wound.
 












   
      
      
   
   


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