Qunchuang optoelectronics will formally include semiconductor packaging and testing into its business project

    According to the Taiwan Provincial Economic Daily, Taiwan, China panel manufacturer qunchuang optoelectronics will hold a regular shareholders‘ meeting on June 24. During this period, in addition to preparing for the re-election of directors, that is, the withdrawal of all the legal representatives of the major shareholder Hon Hai from the board of directors, qunchuang will also amend the articles of association and add a new business item of "semi conductor packaging and testing OEM business products", indicating that its business of "panel level fanout packaging" has reached a certain scale, Therefore, the semiconductor packaging and testing was officially included in the business project.

    At present, the panel industry is in a period of declining prosperity. In the first half of this year, the consumer electronics market demand continued to be depressed. Domestic terminal brands have lowered their annual shipment targets for TV, PC, smart phone and other products, and the market demand for each display screen has also declined significantly. According to the statistics of jiwei.com, the TV industry fell by about 30%, the PC industry by 10%-20%, and the smart phone industry by 30%.

    At this time, qunchuang optoelectronics chose to include semiconductor related businesses in its business projects, highlighting its determination to actively activate the old generation panel factory and seize the semiconductor packaging and testing OEM market. With the gradual development of its business, qunchuang optoelectronics is expected to open a new layout in the future through the semiconductor business.

    With the 3.5 generation panel production line of the old generation and relevant technical capabilities, qunchuang has successfully transformed into the semiconductor packaging field. Yangzhuxiang, general manager of qunchuang optoelectronics, analyzed that the substrate area of the 3.5 generation panel is six times that of the 12 inch wafer, and the area utilization rate can be increased from 85% of the wafer level to 95%, providing the demand for advanced component packaging under the development of 5g and aiot. The value of industrial application can be increased ten times. It is estimated that the packaging output value of derivative semiconductors will reach more than 14billion yuan after mass production.

     In fact, qunchuang has been laying out the semiconductor packaging and testing OEM market for many years. In September, 2019, at semicon Taiwan, qunchuang optoelectronics and Taiwan, China Institute of industry jointly announced that, with the support of the "a + enterprise innovation and R & D plan" of the Technology Department of the Ministry of economy of Taiwan, China, it would cooperate with SONGZHAN, Taitai and Xinying materials, It took three years to complete the establishment and mass production of the world‘s first panel production line transformation fan-out panel packaging technology, and seize the mobile phone and IOT chip packaging market.

    Taiwan, China Industrial Research Institute pointed out that the traditional fanout packaging is mainly "wafer level fanout packaging". However, due to the high cost of equipment and the wafer utilization rate of only 85%, it is very important to expand the use area of process substrates to reduce the manufacturing cost if relevant applications are to continue to expand. "Panel level fan out packaging" highlights its advantage in area utilization rate because the substrate area of the panel is large and square, and the chip is also square. The production area utilization rate can reach 95%.

    Qunchuang will turn the old generation 3.5 panel production line into a panel level fanout chip packaging application. In addition to improving the utilization of the production line, it also has more advantages in terms of capital expenditure. In the future, it can enter the supply chain of medium and high-end packaging products (application processors AP, CPU, GPU), rush to attack packaging factory orders, and create high value with innovative technologies.

    In addition to the project transformation, nine directors will be re elected at the general meeting of shareholders this year. In the list of candidates for directors announced by qunchuang, all four directors and five independent directors are held by natural persons. Hon Hai originally held two legal person directors through its Hongyang venture capital and withdrew from the board of directors of qunchuang.